Area of Expertise:
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Designed multi-layer PCBs up to 18 layers which involves Rigid, Rigid-Flex, High density BGAs, HDI stack-up, BB\HDI Vias.
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Proficient in constraint settings for High speed and complex designs that involves High pin count Fine pitch BGAs, Region constraints, multiple impedance traces, multiple topologies, advanced spacing rules, length constraints...
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Layout activities involved in- Footprint creation, Part Placement, Constraints, Plane Creation, Routing, Length matching, Gerber setup, CAM verification.
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Interfaces supported – DDR4, DDR3, LPDDR, PCIE, RGMII, Gigabit Ethernet, CAN, SPI, I2C, USB, LVDS, HDMI, Wi-Fi, Bluetooth, GPS….
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Experience of working with cross functional engineering teams across different time zones and working closely with Hardware, Mechanical, SI and PI team to better understand the requirements that helps in delivering a successful product.
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Familiar with the IPC standards which helps to meet the design and customer specific requirements starting from Footprint creation to PCB Fabrication.
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Interact with Fab and Assembly house to understand DFA, DFM and DFT requirements at early stage of the design.
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Design to meet Signal Integrity, Power Integrity and Thermal.
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Experienced in Gerber checks to ensure the quality of the PCB.